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 NSxT, NSFxT, NSBxT
Vishay Semiconductors
formerly General Semiconductor
Glass Passivated General Purpose Plastic Rectifier
Reverse Voltage 50 to 1000 Forward Current 8.0A
ITO-220AC (NSFxT)
0.405 (10.27) 0.383 (9.72) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.140 (3.56) DIA. 0.130 (3.30) 0.131 (3.39) DIA. 0.122 (3.08)
TO-220AC (NSxT)
0.415 (10.54) MAX. 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.148 (3.74) 0.113 (2.87) 0.103 (2.62) 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) PIN 1 0.160 (4.06) 0.140 (3.56) 2 1.148 (29.16) 1.118 (28.40) 0.110 (2.79) 0.100 (2.54) 0.560 (14.22) 0.530 (13.46)
CASE 1
0.185 (4.70) 0.175 (4.44) DIA. 0.055 (1.39) 0.045 (1.14) 0.600 (15.5) 0.580 (14.5)
0.676 (17.2) 0.646 (16.4) 0.350 (8.89) 0.330 (8.38)
PIN 2
0.635 (16.13) 0.625 (15.87)
0.350 (8.89) 0.330 (8.38)
0.603 (15.32) 0.573 (14.55) 0.560 (14.22) 0.530 (13.46)
0.191 (4.85) 0.171 (4.35) 0.060 (1.52)
PIN 1 PIN 2
0.110 (2.80) 0.100 (2.54)
PIN 1 PIN 2
0.205 (5.20) 0.195 (4.95)
0.037 (0.94) 0.027 (0.69)
0.022 (0.55) 0.014 (0.36)
0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) 0.037 (0.94) 0.027 (0.68) 0.022 (0.56) 0.014 (0.36)
TO-263AB (NSBxT)
0.411 (10.45) 0.380 (9.65) 0.245 (6.22) MIN K 0.055 (1.40) 0.047 (1.19) 1 K 2 0.624 (15.85) 0.591 (15.00) 0-0.01 (0-0.254) 0.110 (2.79) 0.090 (2.29) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67)
PIN 1 PIN 2 K - HEATSINK
0.190 (4.83) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14)
Mounting Pad Layout TO-263AB
0.42 (10.66)
0.360 (9.14) 0.320 (8.13)
0.33 (8.38) 0.63 (17.02)
Dimensions in inches and (millimeters)
0.021 (0.53) 0.014 (0.36) 0.140 (3.56) 0.110 (2.79)
0.08 (2.032) 0.24 (6.096)
0.095 (2.41)
0.12 (3.05)
0.205 (5.20) 0.195 (4.95)
Features
* Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High forward current capability * High surge current capability * Low forward voltage drop * Glass passivated chip junction * High temperature soldering guaranteed: 260C/10 seconds, 0.160" (4.06mm) lead length
Mechanical Data
Case: JEDEC TO-220AC, ITO-220AC & TO-263AB molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Torque: 10 in. -lbs. max. Mounting Position: Any Weight: 0.064 ounce, 1.81 grams
Document Number 88690 08-Jul-02
www.vishay.com 1
NSxT, NSFxT, NSBxT
Vishay Semiconductors
formerly General Semiconductor
Maximum Ratings & Thermal Characteristics Ratings at 25C ambient temperature unless otherwise specified.
Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=100C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Operating junction and storage temperature range RMS Isolation voltage (NSF type only) from terminals to heatsink with t = 1.0 second, RH 30% Symbols VRRM VRMS VDC IF(AV) NS8 AT 50 35 50 NS8 BT 100 70 100 NS8 DT 200 140 200 NS8 GT 400 280 400 8.0 NS8 JT 600 420 600 NS8 KT 800 560 800 NS8 MT 1000 700 1000 Units V V V A
IFSM TJ, TSTG VISOL
125 -55 to +150 4500 3500(2) 1500(3)
(1)
A C V
Electrical Characteristics
Parameter
Ratings at 25C ambient temperature unless otherwise specified.
Symbols VF IR CJ
NS8 AT
NS8 BT
NS8 DT
NS8 GT 1.1 10 100 55
NS8 JT
NS8 KT
NS8 MT
Units V A pF
Maximum instantaneous forward voltage at 8.0A Maximum DC reverse current at rated DC blocking voltage TC=25C TC=100C
Typical junction capacitance at 4.0V, 1MHz
Thermal Characteristics
Parameter Typical thermal resistance
(4)
Ratings at 25C ambient temperature unless otherwise specified.
Symbols RJC
NSxT 3.0
NSFxt 5.0
NSBxt 3.0
Units C/W
Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110" offset (2) Clip mounting (on case), where leads do overlap heatsink (3) Screw mounting with 4-40 screw, where washer diameter is 4.9mm (0.19") (4) Thermal resistance from junction to case mounted on heat sink
www.vishay.com 2
Document Number 88690 08-Jul-02
NSxT, NSFxT, NSBxT
Vishay Semiconductors
formerly General Semiconductor
Ratings and Characteristic Curves (TA = 25C unless otherwise noted)
Fig. 1 - Forward Current Derating Curve
10 60 HZ Resistive or Inductive Load 175
Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current
Peak Forward Surge Current (A)
150 125 1.0 Cycle 100 75 50 25 0 TJ = TJ max. 8.3ms Single Half Sine-Wave (JEDEC Method)
Average Forward Current (A)
8.0
6.0
4.0
2.0
0 0 50 100 150
1
10
100
Case Temperature (C)
Number of Cycles at 60 HZ
Fig. 3 - Typical Instantaneous Forward Characteristics
100 100
Fig. 4 - Typical Reverse Characteristics
Instantaneous Reverse Current (A)
Instantaneous Forward Current (A)
10
Pulse Width = 300s 1% Duty Cycle
10
TJ = 100C
1
1
TJ = 75C
0.1 0.6
0.1 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40
TJ = 25C 60 80 100
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig. 5 - Typical Junction Capacitance Per Leg
120 TJ = 25C f = 1.0MHZ Vsig = 50MVp-p
Junction Capacitance (pF)
100
80
60 40
20
0 0.1
1
10
100
1,000
Reverse Voltage (V) Document Number 88690 08-Jul-02 www.vishay.com 3


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